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Silver Metallization Stability and Reliability /
Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
London :
Springer London : Imprint: Springer,
2008.
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| Edición: | 1st ed. 2008. |
| Colección: | Engineering Materials and Processes,
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| Temas: | |
| Acceso en línea: | Texto Completo |
MARC
| LEADER | 00000nam a22000005i 4500 | ||
|---|---|---|---|
| 001 | 978-1-84800-027-8 | ||
| 003 | DE-He213 | ||
| 005 | 20220116201111.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 100301s2008 xxk| s |||| 0|eng d | ||
| 020 | |a 9781848000278 |9 978-1-84800-027-8 | ||
| 024 | 7 | |a 10.1007/978-1-84800-027-8 |2 doi | |
| 050 | 4 | |a QC173.458.S87 | |
| 072 | 7 | |a PHFC |2 bicssc | |
| 072 | 7 | |a SCI077000 |2 bisacsh | |
| 072 | 7 | |a PHFC |2 thema | |
| 082 | 0 | 4 | |a 530.417 |2 23 |
| 100 | 1 | |a Adams, Daniel. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 245 | 1 | 0 | |a Silver Metallization |h [electronic resource] : |b Stability and Reliability / |c by Daniel Adams, Terry L. Alford, James W. Mayer. |
| 250 | |a 1st ed. 2008. | ||
| 264 | 1 | |a London : |b Springer London : |b Imprint: Springer, |c 2008. | |
| 300 | |a XII, 123 p. 66 illus. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a text file |b PDF |2 rda | ||
| 490 | 1 | |a Engineering Materials and Processes, |x 2365-0761 | |
| 505 | 0 | |a Silver Thin Film Characterization -- Diffusion Barriers and Self-encapsulation -- Thermal Stability -- Silver Electromigration Resistance -- Integration Issues -- Summary. | |
| 520 | |a Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology. Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. Readers will learn about the: preparation and characterization of elemental silver thin films and silver-metal alloys; formation of diffusion barriers and adhesion promoters; evaluation of the thermal stability of silver under different annealing conditions; evaluation of the electrical properties of silver thin films under various processing conditions; methods of dry etching of silver lines and the integration of silver with low-k dielectric materials. As a valuable resource in this emerging field; Silver Metallization: Stability and Reliability will be very useful to students, scientists, engineers and technologists in the fields of integrated circuits and microelectronics research and development. | ||
| 650 | 0 | |a Surfaces (Physics). | |
| 650 | 0 | |a Industrial engineering. | |
| 650 | 0 | |a Production engineering. | |
| 650 | 0 | |a Metals. | |
| 650 | 0 | |a Surfaces (Technology). | |
| 650 | 0 | |a Thin films. | |
| 650 | 0 | |a Manufactures. | |
| 650 | 1 | 4 | |a Surface and Interface and Thin Film. |
| 650 | 2 | 4 | |a Industrial and Production Engineering. |
| 650 | 2 | 4 | |a Metals and Alloys. |
| 650 | 2 | 4 | |a Surfaces, Interfaces and Thin Film. |
| 650 | 2 | 4 | |a Machines, Tools, Processes. |
| 700 | 1 | |a Alford, Terry L. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 700 | 1 | |a Mayer, James W. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 710 | 2 | |a SpringerLink (Online service) | |
| 773 | 0 | |t Springer Nature eBook | |
| 776 | 0 | 8 | |i Printed edition: |z 9781849967051 |
| 776 | 0 | 8 | |i Printed edition: |z 9781848006843 |
| 776 | 0 | 8 | |i Printed edition: |z 9781848000261 |
| 830 | 0 | |a Engineering Materials and Processes, |x 2365-0761 | |
| 856 | 4 | 0 | |u https://doi.uam.elogim.com/10.1007/978-1-84800-027-8 |z Texto Completo |
| 912 | |a ZDB-2-CMS | ||
| 912 | |a ZDB-2-SXC | ||
| 950 | |a Chemistry and Materials Science (SpringerNature-11644) | ||
| 950 | |a Chemistry and Material Science (R0) (SpringerNature-43709) | ||