Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications /

This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Qu, Shichun (Autor), Liu, Yong (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2015.
Edición:1st ed. 2015.
Temas:
Electronics.
Electronic circuits.
Thermodynamics.
Heat engineering.
Heat transfer.
Mass transfer.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Engineering Thermodynamics, Heat and Mass Transfer.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Chapter 1. Demand and Challenges for Wafer Level Analog and Power Packaging
  • Chapter 2. Fan-In Analog Wafer Level Chip Scale Package
  • Chapter 3. Fan-Out Analog Wafer Level Chip Scale Package
  • Chapter 4. Wafer Level Analog Chip Scale Package Stackable Design
  • Chapter 5. Wafer Level Discrete Power MOSFET Package Design
  • Chapter 6. Wafer Level Packaging TSV/Stack die for Integration of Analog and Power Solution
  • Chapter 7. Thermal Management, Design, Analysis for WLCSP
  • Chapter 8. Electrical and Multi-Physics Simulations for Analog and Power WLCSP
  • Chapter 9. WLCSP Typical Assembly Process
  • Chapter 10. WLCSP Typical Reliability and Test.

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