Copper Electrodeposition for Nanofabrication of Electronics Devices

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Kondo, Kazuo (Editor ), Akolkar, Rohan N. (Editor ), Barkey, Dale P. (Editor ), Yokoi, Masayuki (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2014.
Edición:1st ed. 2014.
Colección:Nanostructure Science and Technology, 171
Temas:
Electrochemistry.
Nanotechnology.
Electronics.
Condensed matter.
Electronics and Microelectronics, Instrumentation.
Condensed Matter Physics.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Copper Electrodeposition
  • Suppression Effect and Additive Chemistry
  • Acceleration Effect
  • Modeling and Simulation
  • Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects
  • Microstructure of Evolution of Copper in Nano-scale Interconnect Features
  • Direct Copper Plating
  • Through Silicon Via
  • Build-up Printed Wiring Boards
  • Copper Foil Smooth on Both Sides for Lithium Ion Battery
  • Through Hole Plating.

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