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Copper Electrodeposition for Nanofabrication of Electronics Devices
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor Corporativo: | |
| Otros Autores: | , , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2014.
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| Edición: | 1st ed. 2014. |
| Colección: | Nanostructure Science and Technology,
171 |
| Temas: | |
| Acceso en línea: | Texto Completo |