Cargando…
Copper Electrodeposition for Nanofabrication of Electronics Devices
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor Corporativo: | |
| Otros Autores: | , , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2014.
|
| Edición: | 1st ed. 2014. |
| Colección: | Nanostructure Science and Technology,
171 |
| Temas: | |
| Acceso en línea: | Texto Completo |
MARC
| LEADER | 00000nam a22000005i 4500 | ||
|---|---|---|---|
| 001 | 978-1-4614-9176-7 | ||
| 003 | DE-He213 | ||
| 005 | 20220116032818.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 131120s2014 xxu| s |||| 0|eng d | ||
| 020 | |a 9781461491767 |9 978-1-4614-9176-7 | ||
| 024 | 7 | |a 10.1007/978-1-4614-9176-7 |2 doi | |
| 050 | 4 | |a QD551-578 | |
| 072 | 7 | |a PNRH |2 bicssc | |
| 072 | 7 | |a SCI013050 |2 bisacsh | |
| 072 | 7 | |a PNRH |2 thema | |
| 082 | 0 | 4 | |a 541.37 |2 23 |
| 245 | 1 | 0 | |a Copper Electrodeposition for Nanofabrication of Electronics Devices |h [electronic resource] / |c edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi. |
| 250 | |a 1st ed. 2014. | ||
| 264 | 1 | |a New York, NY : |b Springer New York : |b Imprint: Springer, |c 2014. | |
| 300 | |a VIII, 282 p. 190 illus., 75 illus. in color. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a text file |b PDF |2 rda | ||
| 490 | 1 | |a Nanostructure Science and Technology, |x 2197-7976 ; |v 171 | |
| 505 | 0 | |a Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating. | |
| 520 | |a This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners. | ||
| 650 | 0 | |a Electrochemistry. | |
| 650 | 0 | |a Nanotechnology. | |
| 650 | 0 | |a Electronics. | |
| 650 | 0 | |a Condensed matter. | |
| 650 | 1 | 4 | |a Electrochemistry. |
| 650 | 2 | 4 | |a Nanotechnology. |
| 650 | 2 | 4 | |a Electronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | |a Condensed Matter Physics. |
| 700 | 1 | |a Kondo, Kazuo. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 700 | 1 | |a Akolkar, Rohan N. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 700 | 1 | |a Barkey, Dale P. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 700 | 1 | |a Yokoi, Masayuki. |e editor. |4 edt |4 http://id.loc.gov/vocabulary/relators/edt | |
| 710 | 2 | |a SpringerLink (Online service) | |
| 773 | 0 | |t Springer Nature eBook | |
| 776 | 0 | 8 | |i Printed edition: |z 9781461491750 |
| 776 | 0 | 8 | |i Printed edition: |z 9781461491774 |
| 776 | 0 | 8 | |i Printed edition: |z 9781493953738 |
| 830 | 0 | |a Nanostructure Science and Technology, |x 2197-7976 ; |v 171 | |
| 856 | 4 | 0 | |u https://doi.uam.elogim.com/10.1007/978-1-4614-9176-7 |z Texto Completo |
| 912 | |a ZDB-2-CMS | ||
| 912 | |a ZDB-2-SXC | ||
| 950 | |a Chemistry and Materials Science (SpringerNature-11644) | ||
| 950 | |a Chemistry and Material Science (R0) (SpringerNature-43709) | ||