Copper Electrodeposition for Nanofabrication of Electronics Devices

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Kondo, Kazuo (Editor ), Akolkar, Rohan N. (Editor ), Barkey, Dale P. (Editor ), Yokoi, Masayuki (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2014.
Edición:1st ed. 2014.
Colección:Nanostructure Science and Technology, 171
Temas:
Electrochemistry.
Nanotechnology.
Electronics.
Condensed matter.
Electronics and Microelectronics, Instrumentation.
Condensed Matter Physics.
Acceso en línea:Texto Completo
Descripción
Sumario:This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners.
Descripción Física:VIII, 282 p. 190 illus., 75 illus. in color. online resource.
ISBN:9781461491767
ISSN:2197-7976 ;

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