Copper Wire Bonding

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cos...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Chauhan, Preeti S. (Autor), Choubey, Anupam (Autor), Zhong, ZhaoWei (Autor), Pecht, Michael G. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2014.
Edición:1st ed. 2014.
Temas:
Mechatronics.
Manufactures.
Optical materials.
Machines, Tools, Processes.
Optical Materials.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Copper Wire Bonding
  • Bonding Process
  • Bonding Metallurgies
  • Wire Bond Evaluation
  • Thermal Reliability Tests
  • Humidity and Electromigration Tests
  • Wire Bond Pads
  • Concerns and Solutions
  • Recommendations
  • Appendix A: Reliability Data
  • Appendix B: Patents on Copper Wire Bonding.

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