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Advanced Thermal Management Materials
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2013.
|
| Edición: | 1st ed. 2013. |
| Temas: | |
| Acceso en línea: | Texto Completo |
MARC
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|---|---|---|---|
| 001 | 978-1-4614-1963-1 | ||
| 003 | DE-He213 | ||
| 005 | 20220119041300.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 120913s2013 xxu| s |||| 0|eng d | ||
| 020 | |a 9781461419631 |9 978-1-4614-1963-1 | ||
| 024 | 7 | |a 10.1007/978-1-4614-1963-1 |2 doi | |
| 050 | 4 | |a HD9502-9502.5 | |
| 072 | 7 | |a RN |2 bicssc | |
| 072 | 7 | |a TEC031000 |2 bisacsh | |
| 072 | 7 | |a RN |2 thema | |
| 082 | 0 | 4 | |a 333.7 |2 23 |
| 100 | 1 | |a Jiang, Guosheng. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 245 | 1 | 0 | |a Advanced Thermal Management Materials |h [electronic resource] / |c by Guosheng Jiang, Liyong Diao, Ken Kuang. |
| 250 | |a 1st ed. 2013. | ||
| 264 | 1 | |a New York, NY : |b Springer New York : |b Imprint: Springer, |c 2013. | |
| 300 | |a XII, 156 p. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a text file |b PDF |2 rda | ||
| 505 | 0 | |a Introduction to Thermal Management in Microelectronics Packaging -- Requirements of Thermal Management Materials -- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials -- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies -- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications -- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications -- Al/SiC Thermal Management Materials -- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper -- Future Trend of Advanced Thermal Management Materials. | |
| 520 | |a Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. This book also: Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials Covers system and component integration of advanced packaging materials Advanced Thermal Management Materials is an ideal book for microelectronics and packaging engineers, scientists and researchers in academia and industry interested in thermal packaging in high performance systems. . | ||
| 650 | 0 | |a Energy policy. | |
| 650 | 0 | |a Energy and state. | |
| 650 | 0 | |a Electronics. | |
| 650 | 0 | |a Thermodynamics. | |
| 650 | 0 | |a Heat engineering. | |
| 650 | 0 | |a Heat transfer. | |
| 650 | 0 | |a Mass transfer. | |
| 650 | 0 | |a Metals. | |
| 650 | 1 | 4 | |a Energy Policy, Economics and Management. |
| 650 | 2 | 4 | |a Electronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | |a Engineering Thermodynamics, Heat and Mass Transfer. |
| 650 | 2 | 4 | |a Metals and Alloys. |
| 700 | 1 | |a Diao, Liyong. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 700 | 1 | |a Kuang, Ken. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 710 | 2 | |a SpringerLink (Online service) | |
| 773 | 0 | |t Springer Nature eBook | |
| 776 | 0 | 8 | |i Printed edition: |z 9781461419648 |
| 776 | 0 | 8 | |i Printed edition: |z 9781489992543 |
| 776 | 0 | 8 | |i Printed edition: |z 9781461419624 |
| 856 | 4 | 0 | |u https://doi.uam.elogim.com/10.1007/978-1-4614-1963-1 |z Texto Completo |
| 912 | |a ZDB-2-ENE | ||
| 912 | |a ZDB-2-SXEN | ||
| 950 | |a Energy (SpringerNature-40367) | ||
| 950 | |a Energy (R0) (SpringerNature-43717) | ||