Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability /

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the a...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: He, Ming (Autor), Lu, Toh-Ming (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2012.
Edición:1st ed. 2012.
Colección:Springer Series in Materials Science, 157
Temas:
Electronics.
Optical materials.
Surfaces (Physics).
Microtechnology.
Microelectromechanical systems.
Electrochemistry.
Thermodynamics.
Heat engineering.
Heat transfer.
Mass transfer.
Electronics and Microelectronics, Instrumentation.
Optical Materials.
Surface and Interface and Thin Film.
Microsystems and MEMS.
Engineering Thermodynamics, Heat and Mass Transfer.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Preface
  • 1. Introduction
  • 2. Metal-Dielectric Diffusion Processes: Fundamentals
  • 3. Experimental Techniques
  • 4. Al-Dielectric Interfaces
  • 5. Cu-Dielectric Interfaces
  • 6. Barrier Metal-Dielectric Interfaces
  • 7. Self-Forming Barriers. 8. Kinetics of Ion Drift
  • 9. Time-Dependent Dielectric Breakdown (TDDB) and Future Directions.

Ejemplares similares