Design for Manufacturability From 1D to 4D for 90-22 nm Technology Nodes /
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers a...
Clasificación: | Libro Electrónico |
---|---|
Autor principal: | Balasinski, Artur (Autor) |
Autor Corporativo: | SpringerLink (Online service) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2014.
|
Edición: | 1st ed. 2014. |
Temas: | |
Acceso en línea: | Texto Completo |
Ejemplares similares
-
Bias Temperature Instability for Devices and Circuits
Publicado: (2014) -
Emerging Nanotechnologies Test, Defect Tolerance, and Reliability /
Publicado: (2008) -
Secure System Design and Trustable Computing
Publicado: (2016) -
Design for Manufacturability with Advanced Lithography
por: Yu, Bei, et al.
Publicado: (2016) -
Circuit Design on Plastic Foils
por: Raiteri, Daniele, et al.
Publicado: (2015)