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Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Molecular Modeling and Multiscaling Issues for Electronic Material Applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor Corporativo: | |
| Otros Autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2012.
|
| Edición: | 1st ed. 2012. |
| Temas: | |
| Acceso en línea: | Texto Completo |
Tabla de Contenidos:
- Part I Quantum Mechanics and Molecular Methods: Uses for Property Understanding
- Atomistic Simulations of Microelectronic Materials: Prediction of Mechanical, Thermal and Electrical Properties
- Using Molecular Modeling Trending to Understand Dielectric Susceptibility
- Understanding Cleaner Efficiency for BARC ("Bottom Anti-Reflective Coating") After Plasma Etch in Dual Damascene Structures Through the Practical Use of Molecular Modeling Trends
- Part II. Large scale atomistic methods and scaling methods to understand mechanical failure in metals
- Roles of grain boundaries in the strength of metals by using atomic simulations
- Semi Emprical Low Cycle Fatigue Crack Growth Analysis of Nanostructure Chip-To-Package Copper Interconnect Using Molecular Simulation
- Part III. Molecular scale modeling uses for Carbon Nanotube behavior
- Thermal conductivity of carbon nanotube under external mechanical stresses and moisture by molecular dynamics simulation
- Influence of Structural Parameters of Carbon Nanotubes on Their Thermal Conductivity - Numerical Assessment
- Part IV.Molecular methods to understand mechanical and physical properties
- The mechanical properties modeling of nano-scale materials by molecular dynamics
- Molecular design of SAM (Self-Assembled Monolayer) coupling agent for reliable interfaces by Molecular Dynamics Simulation
- Microelectronics Packaging Materials:Correlating Structure and Property using Molecular Dynamics Simulations
- PartV. Multiscale methods and perspectives
- Investigation of interfacial delamination in electronic packages
- Multiscale approach optimization on surface wettabilty change
- Glass Transition Analysis of Crosslinked Polymers -Numerical and Mesoscale Approach
- Mechanical Properties of an Epoxy, Modeled Using Particle Dynamics as Parameterized through Molecular Modeling. .