Lead Free Solder Mechanics and Reliability /

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free sol...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Pang, John Hock Lye (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2012.
Edición:1st ed. 2012.
Temas:
Electronics.
Optical materials.
Mechanics, Applied.
Solids.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Optical Materials.
Solid Mechanics.
Electronic Circuits and Systems.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Introduction
  • Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models
  • Fatigue Life Prediction Models
  • Finite Element Analysis and Design-For-Reliability
  • Thermo-Mechanical Reliability Test and Analysis
  • Dynamic Mechanical Reliability Test and Analysis
  • Thermal Cycling Aging Effects on Board-Level Drop Test Result.

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