Lead Free Solder Mechanics and Reliability /
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free sol...
Clasificación: | Libro Electrónico |
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Autor principal: | Pang, John Hock Lye (Autor) |
Autor Corporativo: | SpringerLink (Online service) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2012.
|
Edición: | 1st ed. 2012. |
Temas: | |
Acceso en línea: | Texto Completo |
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