3D Integration for NoC-based SoC Architectures

Back Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems con...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Sheibanyrad, Abbas (Editor ), Pétrot, Frédéric (Editor ), Jantsch, Axel (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2011.
Edición:1st ed. 2011.
Colección:Integrated Circuits and Systems,
Temas:
Electronic circuits.
Software engineering.
Electronic Circuits and Systems.
Software Engineering.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Three-Dimensional Integration of Integrated Circuits - an Introduction
  • The Promises and Limitation of 3-D Integration
  • Testing 3D Stacked ICs Containing Through-Silicon Vias
  • Design and Computer Aided Design of 3DIC
  • Physical Analysis of NoC Topologies for 3-D Integrated Systems
  • Three-Dimensional Networks-on-Chip: Performance Evaluation
  • Asynchronous 3D-NoCs
  • Design of Application-Specific 3D Networks-on-Chip Architectures
  • 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks
  • 3-D NoC on Inductive Wireless Interconnect
  • Influence of Stacked 3D Memory/Cache architectures on GPUs.

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