Coupled Data Communication Techniques for High-Performance and Low-Power Computing

Designers of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains furt...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Ho, Ron (Editor ), Drost, Robert (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2010.
Edición:1st ed. 2010.
Colección:Integrated Circuits and Systems,
Temas:
Electronic circuits.
Electronics.
Electrical engineering.
Computers.
Electronic Circuits and Systems.
Electronics and Microelectronics, Instrumentation.
Electrical and Electronic Engineering.
Computer Hardware.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • to Coupled Data Technologies
  • Overview of 3D Technologies
  • Power delivery, signaling and cooling for 2D and 3D integrated systems
  • Coupled Data Technologies
  • Capacitive Coupled Communication
  • Inductive Coupled Communications
  • Use of AC Coupled Interconnect in Contactless Packaging
  • Enabling Coupled Data Technologies
  • Aligning chips face-to-face for dense capacitive communication
  • Extending Data Coupling Technologies
  • Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication
  • AC Coupled Wireless Power Delivery.

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