Constrained Deformation of Materials Devices, Heterogeneous Structures and Thermo-Mechanical Modeling /

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" presents an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniat...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Shen, Y.-L (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2010.
Edición:1st ed. 2010.
Temas:
Mechanical engineering.
Industrial engineering.
Production engineering.
Mechanics.
Mechanics, Applied.
Solids.
Surfaces (Technology).
Thin films.
Mechanical Engineering.
Industrial and Production Engineering.
Classical Mechanics.
Solid Mechanics.
Surfaces, Interfaces and Thin Film.
Acceso en línea:Texto Completo

MARC

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100 1 |a Shen, Y.-L.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Constrained Deformation of Materials  |h [electronic resource] :  |b Devices, Heterogeneous Structures and Thermo-Mechanical Modeling /  |c by Y.-L. Shen. 
250 |a 1st ed. 2010. 
264 1 |a New York, NY :  |b Springer US :  |b Imprint: Springer,  |c 2010. 
300 |a IX, 281 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
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505 0 |a Mechanics Preliminaries -- Thin Continuous Films -- Patterned Films in Micro-devices -- Electronic Packaging Structures -- Heterogeneous Materials -- Challenges and Outlook. 
520 |a "Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" presents an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike. 
650 0 |a Mechanical engineering. 
650 0 |a Industrial engineering. 
650 0 |a Production engineering. 
650 0 |a Mechanics. 
650 0 |a Mechanics, Applied. 
650 0 |a Solids. 
650 0 |a Surfaces (Technology). 
650 0 |a Thin films. 
650 1 4 |a Mechanical Engineering. 
650 2 4 |a Industrial and Production Engineering. 
650 2 4 |a Classical Mechanics. 
650 2 4 |a Solid Mechanics. 
650 2 4 |a Surfaces, Interfaces and Thin Film. 
710 2 |a SpringerLink (Online service) 
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776 0 8 |i Printed edition:  |z 9781441963116 
776 0 8 |i Printed edition:  |z 9781489986122 
776 0 8 |i Printed edition:  |z 9781441963130 
856 4 0 |u https://doi.uam.elogim.com/10.1007/978-1-4419-6312-3  |z Texto Completo 
912 |a ZDB-2-ENG 
912 |a ZDB-2-SXE 
950 |a Engineering (SpringerNature-11647) 
950 |a Engineering (R0) (SpringerNature-43712) 

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