Advanced Flip Chip Packaging

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Tong, Ho-Ming (Editor ), Lai, Yi-Shao (Editor ), Wong, C.P (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2013.
Edición:1st ed. 2013.
Temas:
Electronics.
Electronic circuits.
Optical materials.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Optical Materials.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Flip Chip Technology Overview and Early Beginnings
  • Technology Trends of Flip Chip
  • Bumping Technologies
  • Flip-Chip Interconnections: Past, Present and Future
  • Underfill
  • Conductive Adhesives for Flip Chip Applications
  • Enabling Substrate Technologies: Past, Present and Future
  • IC-Package-System Integrated Design
  • Thermal Management of Flip Chip Packages
  • Thermo-Mechanical Reliability in Flip Chip Packages
  •  Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.

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