Moisture Sensitivity of Plastic Packages of IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industri...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Fan, X.J (Editor ), Suhir, E. (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2010.
Edición:1st ed. 2010.
Colección:Micro- and Opto-Electronic Materials, Structures, and Systems,
Temas:
Electronics.
Optical materials.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical Materials.
Technology and Engineering.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-Induced Damages in Polymeric Materials in Electronic Packaging
  • Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds
  • Real-Time Characterization of Moisture Absorption and Desorption
  • Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices
  • Characterization of Hygroscopic Deformations by Moiré Interferometry
  • Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques
  • Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis
  • Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages
  • Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages
  • Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections
  • Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices
  • Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices
  • New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels
  • Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages
  • Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages
  • Industrial Applications of Moisture-Related Reliability Problems
  • Underfill Selection Against Moisture in Flip Chip BGA Packages
  • Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale Packages (SCSPs)
  • Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for Microelectronic Packaging
  • Moisture-Driven Electromigrative Degradation in Microelectronic Packages
  • Interfacial Moisture Diffusion: Molecular Dynamics Simulation and Experimental Evaluation.

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