Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industri...
Clasificación: | Libro Electrónico |
---|---|
Autor Corporativo: | SpringerLink (Online service) |
Otros Autores: | Fan, X.J (Editor ), Suhir, E. (Editor ) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2010.
|
Edición: | 1st ed. 2010. |
Colección: | Micro- and Opto-Electronic Materials, Structures, and Systems,
|
Temas: | |
Acceso en línea: | Texto Completo |
Ejemplares similares
-
Wafer Level 3-D ICs Process Technology
Publicado: (2008) -
Integrated Circuit Packaging, Assembly and Interconnections
por: Greig, William
Publicado: (2007) -
Vacuum Electronics Components and Devices /
Publicado: (2008) -
Advanced Flip Chip Packaging
Publicado: (2013) -
Physical Limitations of Semiconductor Devices
por: Vashchenko, Vladislav A., et al.
Publicado: (2008)