Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures /

This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the read...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Xie, Yuan (Editor ), Cong, Jingsheng Jason (Editor ), Sapatnekar, Sachin (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2010.
Edición:1st ed. 2010.
Colección:Integrated Circuits and Systems,
Temas:
Electronics.
Optical materials.
Surfaces (Technology).
Thin films.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical Materials.
Surfaces, Interfaces and Thin Film.
Technology and Engineering.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • 3D Process Technology Considerations
  • Thermal and Power Delivery Challenges in 3D ICs
  • Thermal-Aware 3D Floorplan
  • Thermal-Aware 3D Placement
  • Thermal Via Insertion and Thermally Aware Routing in 3D ICs
  • Three-Dimensional Microprocessor Design
  • Three-Dimensional Network-on-Chip Architecture
  • PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers
  • System-Level 3D IC Cost Analysis and Design Exploration.

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