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Copper Interconnect Technology
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began t...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2009.
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| Edición: | 1st ed. 2009. |
| Temas: | |
| Acceso en línea: | Texto Completo |
Tabla de Contenidos:
- Dielectric Materials
- Diffusion and Barrier Layers
- Pattern Generation
- Deposition Technologies of Materials for Cu-Interconnects
- The Copper Damascene Process and Chemical Mechanical Polishing
- Conduction and Electromigration
- Routing and Reliability.