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Nano-Bio- Electronic, Photonic and MEMS Packaging

Nanotechnologies are frequently being applied to the biotechnology area, especially in nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials at the device level. Nano-Bio- Electronic, Photonic and MEMS Packaging discusses how nanofabrication...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Wong, C.P (Editor ), Moon, Kyoung-Sik (Editor ), Li, Yi (Grace) (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2010.
Edición:1st ed. 2010.
Temas:
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Nanomaterials for Microelectronic and Bio-packaging
  • Nano-conductive Adhesives for Nano-electronics Interconnection
  • Biomimetic Lotus Effect Surfaces for Nanopackaging
  • Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials
  • Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications
  • 1D Nanowire Electrode Materials for Power Sources of Microelectronics
  • Mechanical Energy Harvesting Using Wurtzite Nanowires
  • Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging
  • to Nanoparticle-Based Integrated Passives
  • Thermally Conductive Nanocomposites
  • Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension
  • On-Chip Thermal Management and Hot-Spot Remediation
  • Some Aspects of Microchannel Heat Transfer
  • Nanoprobes for Live-Cell Gene Detection
  • Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips
  • Packaging of Biomolecular and Chemical Microsensors
  • Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging
  • Molecular Dynamics Applications in Packaging
  • Nanoscale Deformation and Strain Analysis by AFM/DIC Technique
  • Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.