Mechanics of Microelectronics

From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qual...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Zhang, G.Q (Autor), Driel, W.D. van (Autor), Fan, X.J (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Dordrecht : Springer Netherlands : Imprint: Springer, 2006.
Edición:1st ed. 2006.
Colección:Solid Mechanics and Its Applications, 141
Temas:
Mechanics, Applied.
Mechanical engineering.
Computational intelligence.
Engineering Mechanics.
Mechanical Engineering.
Computational Intelligence.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Microelectronics Technology
  • Reliability Practice
  • Thermal Management
  • to Advanced Mechanics
  • Thermo-Mechanics of Integrated Circuits and Packages
  • Characterization and Modelling of Moisture Behaviour
  • Characterization and Modelling of Solder Joint Reliability
  • Virtual Thermo-Mechanical Prototyping
  • Challenges and Future Perspectives.

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