Mechanics of Microelectronics

From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qual...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Zhang, G.Q (Autor), Driel, W.D. van (Autor), Fan, X.J (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Dordrecht : Springer Netherlands : Imprint: Springer, 2006.
Edición:1st ed. 2006.
Colección:Solid Mechanics and Its Applications, 141
Temas:
Mechanics, Applied.
Mechanical engineering.
Computational intelligence.
Engineering Mechanics.
Mechanical Engineering.
Computational Intelligence.
Acceso en línea:Texto Completo

MARC

LEADER 00000nam a22000005i 4500
001 978-1-4020-4935-4
003 DE-He213
005 20220117125946.0
007 cr nn 008mamaa
008 100301s2006 ne | s |||| 0|eng d
020 |a 9781402049354  |9 978-1-4020-4935-4 
024 7 |a 10.1007/1-4020-4935-8  |2 doi 
050 4 |a TA349-359 
072 7 |a TGB  |2 bicssc 
072 7 |a TEC009070  |2 bisacsh 
072 7 |a TGB  |2 thema 
082 0 4 |a 620.1  |2 23 
100 1 |a Zhang, G.Q.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Mechanics of Microelectronics  |h [electronic resource] /  |c by G.Q. Zhang, W.D. van Driel, X.J. Fan. 
250 |a 1st ed. 2006. 
264 1 |a Dordrecht :  |b Springer Netherlands :  |b Imprint: Springer,  |c 2006. 
300 |a XIV, 566 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Solid Mechanics and Its Applications,  |x 2214-7764 ;  |v 141 
505 0 |a Microelectronics Technology -- Reliability Practice -- Thermal Management -- to Advanced Mechanics -- Thermo-Mechanics of Integrated Circuits and Packages -- Characterization and Modelling of Moisture Behaviour -- Characterization and Modelling of Solder Joint Reliability -- Virtual Thermo-Mechanical Prototyping -- Challenges and Future Perspectives. 
520 |a From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies. 
650 0 |a Mechanics, Applied. 
650 0 |a Mechanical engineering. 
650 0 |a Computational intelligence. 
650 1 4 |a Engineering Mechanics. 
650 2 4 |a Mechanical Engineering. 
650 2 4 |a Computational Intelligence. 
700 1 |a Driel, W.D. van.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Fan, X.J.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9789048109227 
776 0 8 |i Printed edition:  |z 9789048172313 
776 0 8 |i Printed edition:  |z 9781402049347 
830 0 |a Solid Mechanics and Its Applications,  |x 2214-7764 ;  |v 141 
856 4 0 |u https://doi.uam.elogim.com/10.1007/1-4020-4935-8  |z Texto Completo 
912 |a ZDB-2-ENG 
912 |a ZDB-2-SXE 
950 |a Engineering (SpringerNature-11647) 
950 |a Engineering (R0) (SpringerNature-43712) 

Ejemplares similares