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Bonding in Microsystem Technology
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applicati...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Dordrecht :
Springer Netherlands : Imprint: Springer,
2006.
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| Edición: | 1st ed. 2006. |
| Colección: | Springer Series in Advanced Microelectronics,
24 |
| Temas: | |
| Acceso en línea: | Texto Completo |
Tabla de Contenidos:
- Some Remarks on Microsystem Systematics and Development
- Deep, Three-Dimensional Silicon Micromachining
- Bonding
- Classification of Bonding and Closing Remarks.