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Bonding in Microsystem Technology
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applicati...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Autor Corporativo: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Dordrecht :
Springer Netherlands : Imprint: Springer,
2006.
|
| Edición: | 1st ed. 2006. |
| Colección: | Springer Series in Advanced Microelectronics,
24 |
| Temas: | |
| Acceso en línea: | Texto Completo |
MARC
| LEADER | 00000nam a22000005i 4500 | ||
|---|---|---|---|
| 001 | 978-1-4020-4589-9 | ||
| 003 | DE-He213 | ||
| 005 | 20220116200152.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 100301s2006 ne | s |||| 0|eng d | ||
| 020 | |a 9781402045899 |9 978-1-4020-4589-9 | ||
| 024 | 7 | |a 10.1007/1-4020-4589-1 |2 doi | |
| 050 | 4 | |a TA349-359 | |
| 072 | 7 | |a TGMD |2 bicssc | |
| 072 | 7 | |a SCI096000 |2 bisacsh | |
| 072 | 7 | |a TGMD |2 thema | |
| 082 | 0 | 4 | |a 620.105 |2 23 |
| 100 | 1 | |a Dziuban, Jan A. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 245 | 1 | 0 | |a Bonding in Microsystem Technology |h [electronic resource] / |c by Jan A. Dziuban. |
| 250 | |a 1st ed. 2006. | ||
| 264 | 1 | |a Dordrecht : |b Springer Netherlands : |b Imprint: Springer, |c 2006. | |
| 300 | |a XVIII, 334 p. |b online resource. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a text file |b PDF |2 rda | ||
| 490 | 1 | |a Springer Series in Advanced Microelectronics, |x 2197-6643 ; |v 24 | |
| 505 | 0 | |a Some Remarks on Microsystem Systematics and Development -- Deep, Three-Dimensional Silicon Micromachining -- Bonding -- Classification of Bonding and Closing Remarks. | |
| 520 | |a Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author's personal experience. | ||
| 650 | 0 | |a Mechanics, Applied. | |
| 650 | 0 | |a Solids. | |
| 650 | 0 | |a Engineering. | |
| 650 | 0 | |a Optical materials. | |
| 650 | 0 | |a Electronics. | |
| 650 | 0 | |a Manufactures. | |
| 650 | 1 | 4 | |a Solid Mechanics. |
| 650 | 2 | 4 | |a Technology and Engineering. |
| 650 | 2 | 4 | |a Optical Materials. |
| 650 | 2 | 4 | |a Electronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | |a Machines, Tools, Processes. |
| 710 | 2 | |a SpringerLink (Online service) | |
| 773 | 0 | |t Springer Nature eBook | |
| 776 | 0 | 8 | |i Printed edition: |z 9789048107773 |
| 776 | 0 | 8 | |i Printed edition: |z 9789048171514 |
| 776 | 0 | 8 | |i Printed edition: |z 9781402045783 |
| 830 | 0 | |a Springer Series in Advanced Microelectronics, |x 2197-6643 ; |v 24 | |
| 856 | 4 | 0 | |u https://doi.uam.elogim.com/10.1007/1-4020-4589-1 |z Texto Completo |
| 912 | |a ZDB-2-ENG | ||
| 912 | |a ZDB-2-SXE | ||
| 950 | |a Engineering (SpringerNature-11647) | ||
| 950 | |a Engineering (R0) (SpringerNature-43712) | ||