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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and conti...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Tan, Cher Ming (Autor), Li, Wei (Autor), Gan, Zhenghao (Autor), Hou, Yuejin (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: London : Springer London : Imprint: Springer, 2011.
Edición:1st ed. 2011.
Colección:Springer Series in Reliability Engineering,
Temas:
Acceso en línea:Texto Completo

MARC

LEADER 00000nam a22000005i 4500
001 978-0-85729-310-7
003 DE-He213
005 20220119143332.0
007 cr nn 008mamaa
008 110326s2011 xxk| s |||| 0|eng d
020 |a 9780857293107  |9 978-0-85729-310-7 
024 7 |a 10.1007/978-0-85729-310-7  |2 doi 
050 4 |a TH9701-9745 
072 7 |a TNKS  |2 bicssc 
072 7 |a TEC032000  |2 bisacsh 
072 7 |a TNKS  |2 thema 
082 0 4 |a 621  |2 23 
100 1 |a Tan, Cher Ming.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections  |h [electronic resource] /  |c by Cher Ming Tan, Wei Li, Zhenghao Gan, Yuejin Hou. 
250 |a 1st ed. 2011. 
264 1 |a London :  |b Springer London :  |b Imprint: Springer,  |c 2011. 
300 |a VIII, 152 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Springer Series in Reliability Engineering,  |x 2196-999X 
505 0 |a 1. Introduction -- 2. Development of Physics-based Modeling for ULSI Interconnections Failure Mechanisms: Electromigration and Stress Induced Voiding -- 3. Introduction and General Theory of Finite Element Method -- 4. Finite Element Method for Electromigration Study -- 5. Finite Element Method for Stress Induced Voiding -- 6. Finite Element Method for Dielectric Reliability. 
520 |a Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics. To help readers cope with the increasing sophistication of FEMs' applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will: introduce the principle of FEMs; review numerical modeling of ULSI interconnect reliability; describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; and discuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method. A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader's understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability. 
650 0 |a Security systems. 
650 0 |a Computational intelligence. 
650 0 |a Electronics. 
650 0 |a Optical materials. 
650 0 |a Differential equations. 
650 1 4 |a Security Science and Technology. 
650 2 4 |a Computational Intelligence. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
650 2 4 |a Optical Materials. 
650 2 4 |a Differential Equations. 
700 1 |a Li, Wei.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Gan, Zhenghao.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
700 1 |a Hou, Yuejin.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9780857293091 
776 0 8 |i Printed edition:  |z 9781447126416 
776 0 8 |i Printed edition:  |z 9780857293114 
830 0 |a Springer Series in Reliability Engineering,  |x 2196-999X 
856 4 0 |u https://doi.uam.elogim.com/10.1007/978-0-85729-310-7  |z Texto Completo 
912 |a ZDB-2-ENG 
912 |a ZDB-2-SXE 
950 |a Engineering (SpringerNature-11647) 
950 |a Engineering (R0) (SpringerNature-43712)