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|a 9780387774053
|9 978-0-387-77405-3
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|a 10.1007/978-0-387-77405-3
|2 doi
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|a TK7867-7867.5
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|a 621.3815
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|a Micro-Assembly Technologies and Applications
|h [electronic resource] :
|b IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France, February 10-13, 2008 /
|c edited by Svetan Ratchev.
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|a 1st ed. 2008.
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|a New York, NY :
|b Springer US :
|b Imprint: Springer,
|c 2008.
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|a XIII, 416 p.
|b online resource.
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
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|a online resource
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|a text file
|b PDF
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|a IFIP Advances in Information and Communication Technology,
|x 1868-422X ;
|v 260
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|a Design of Micro Products -- Application of a DF?A Methodology to facilitate the assembly of a Micro/Nano Measurement Device -- A DFA Framework for Hybrid Microsystems -- Statistical Assemblies with form Errors - A 2D Example -- A Classification and Coding System for Micro-Assembly -- A Method for Three Dimensional Tolerance Analysis and Synthesis Applied to Complex and Precise Assemblies -- New Designs for Submillimetric Press-Fitting -- Design and Testing of an Ortho-Planar Micro-Valve -- Robust Design of a Lens System of Variable Refraction Power with Respect to the Assembly Process -- Micro-Assembly Processes and Applications -- Product-Process Ontology for Managing Assembly Specific Knowledge Between Product Design and Assembly System Simulation -- Bridging the Gap - from Process Related Documentation to an Integrated Process and Application Knowledge Management in Micro Systems Technology -- Distributed Simulation in Manufacturing Using High Level Architecture -- Adaptive Packaging Solution for a Microlens Array Placed Over a Micro-UV-LED Array -- Solder Bumping - A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems -- Fluidassem - A New Method of Fluidic-Based Assembly with Surface Tension -- Concepts for Hybrid Micro Assembly Using Hot Melt Joining -- Application of Microstereolithography Technology in Micromanufacturing -- In Situ Microassembly -- Interest of the Inertial Tolerancing Method in the Case of Watch Making Micro Assembly -- Precision Assembly of Active Microsystems with a Size-Adapted Assembly System -- Assembly of Osseous Fragments in Orthopaedic Surgery: The Need for New Standards of Evaluation -- Gripping and Feeding Solutions for Micro-Assembly -- A Critical Review of Releasing Strategies in Microparts Handling -- A Low Cost Coarse/Fine Piezoelectrically Actuated Microgripper with Force Measurement Adapted to Eupass Control Structure -- Development of A Monolithic Shape Memory Alloy Manipulator -- Statically Determined Gripper Construction -- Precision Positioning down to Single Nanometres Based on Micro Harmonic Drive Systems -- Assembly of a Micro Ball-Bearing using a Capillary Gripper and a Microcomponent Feeder -- Pneumatic Contactless Microfeeder, Design Optimisation and Experimental Validation -- Pneumatic Positioning System for Precision Assembly -- Manufacturing of Devices for the Parallel Precision Alignment of Multiple Micro Components -- Towards a Traceable Infrastructure for Low Force Measurements -- When Manufacturing Capability Exceeds Control Capability: The Paradox of High Precision Products, or is it Possible to Assemble Functional Products out of Components we are Unable to Measure? -- Impact Forces Reduction for High-Speed Micro-Assembly -- Development of Micro-Assembly Production Systems -- Strategies and Devices for a Modular Desktop Factory -- A Decision Making Tool for Reconfigurable Assembly Lines - Eupass Project -- Standardised Interface and Construction Kit for Micro-Assembly -- Towards a Publish / Subscribe Control Architecture for Precision Assembly with the Data Distribution Service -- Smart Assembly - Data and Model Driven -- Man-Robot Cooperation - New Technologies and New Solutions -- Integration of Design and Assembly Using Augmented Reality -- Concept for an Industrial Ubiquitous Assembly Robot.
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|a International Federation for Information Processing The IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication. The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; computers and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction. Proceedings and post-proceedings of referred international conferences in computer science and interdisciplinary fields are featured. These results often precede journal publication and represent the most current research. The principal aim of the IFIP series is to encourage education and the dissemination and exchange of information about all aspects of computing. For more information about the 300 other books in the IFIP series, please visit www.springer.com.
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|a Electronic circuits.
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|a Artificial intelligence.
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|a Application software.
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|a Electronic Circuits and Systems.
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|a Artificial Intelligence.
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|a Computer and Information Systems Applications.
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|a Ratchev, Svetan.
|e editor.
|4 edt
|4 http://id.loc.gov/vocabulary/relators/edt
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|a SpringerLink (Online service)
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|t Springer Nature eBook
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|i Printed edition:
|z 9780387521862
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|i Printed edition:
|z 9781441945914
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|i Printed edition:
|z 9780387774022
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|a IFIP Advances in Information and Communication Technology,
|x 1868-422X ;
|v 260
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|u https://doi.uam.elogim.com/10.1007/978-0-387-77405-3
|z Texto Completo
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|a ZDB-2-SCS
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|a ZDB-2-SXCS
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|a Computer Science (SpringerNature-11645)
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|a Computer Science (R0) (SpringerNature-43710)
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