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Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for impro...
| Clasificación: | Libro Electrónico |
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| Autor Corporativo: | |
| Otros Autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2008.
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| Edición: | 1st ed. 2008. |
| Colección: | Integrated Circuits and Systems,
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| Temas: | |
| Acceso en línea: | Texto Completo |