Cargando…

Silicon Devices and Process Integration Deep Submicron and Nano-Scale Technologies /

Silicon Devices and Process Integration is compiled from industrial and academic lecture notes and reflects years of experience in the development of silicon devices. It is prepared specifically for engineers and scientists in semiconductor research, development and manufacturing. It is also suitabl...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: El-Kareh, Badih (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2009.
Edición:1st ed. 2009.
Temas:
Acceso en línea:Texto Completo

MARC

LEADER 00000nam a22000005i 4500
001 978-0-387-69010-0
003 DE-He213
005 20220116175107.0
007 cr nn 008mamaa
008 100301s2009 xxu| s |||| 0|eng d
020 |a 9780387690100  |9 978-0-387-69010-0 
024 7 |a 10.1007/978-0-387-69010-0  |2 doi 
050 4 |a TK7867-7867.5 
072 7 |a TJFC  |2 bicssc 
072 7 |a TEC008010  |2 bisacsh 
072 7 |a TJFC  |2 thema 
082 0 4 |a 621.3815  |2 23 
100 1 |a El-Kareh, Badih.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Silicon Devices and Process Integration  |h [electronic resource] :  |b Deep Submicron and Nano-Scale Technologies /  |c by Badih El-Kareh. 
250 |a 1st ed. 2009. 
264 1 |a New York, NY :  |b Springer US :  |b Imprint: Springer,  |c 2009. 
300 |a XXVI, 598 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a Properties of the Silicon Crystal. Valence-bond and energy-band models. Thermal equilibrium statistics. Carrier transport mechanisms. Non-equilibrium conditions and carrier lifetime -- Junctions and Contacts. Ohmic, non-ohmic, and rectifying contacts. PN junctions, homo- and hetero-junctions. Contact und junction characterization, parameter extraction. Varactors -- Junction Field-Effect Transistor, JFET. Structure and mode of operation. Physics of JFET. JFET characterization and parameter extraction. High-voltage applications. Parasitic effects -- Bipolar Junction Transistor, BJT. Structure and mode of operation. Physics of BJT. Heterojunction Bipolar Transistor, HBT. Transistor characterization and parameter extraction. High-voltage applications -- Parasitic effects. 
520 |a Silicon Devices and Process Integration is compiled from industrial and academic lecture notes and reflects years of experience in the development of silicon devices. It is prepared specifically for engineers and scientists in semiconductor research, development and manufacturing. It is also suitable for a one-semester course in electrical engineering and materials science at the upper undergraduate or lower graduate level. The book covers both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Topics covered include: MOS structure, parameter extraction - Short and narrow-channel effects - CMOS mobility enhancement techniques - High-K gate dielectrics, advanced gate stacks - Low-K dielectrics and Cu interconnects - Analog devices and passive components - CMOS and BiCMOS process integration - DRAM, SRAM and NVM cell structures. The book covers state-of-the-art silicon devices and integrated process technologies. It represents a comprehensive discussion of modern silicon devices, their characteristics, and interactions with process parameters. 
650 0 |a Electronic circuits. 
650 0 |a Electronics. 
650 0 |a Electrical engineering. 
650 0 |a Materials science. 
650 1 4 |a Electronic Circuits and Systems. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
650 2 4 |a Electrical and Electronic Engineering. 
650 2 4 |a Materials Science. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9780387563954 
776 0 8 |i Printed edition:  |z 9781441942241 
776 0 8 |i Printed edition:  |z 9780387367989 
856 4 0 |u https://doi.uam.elogim.com/10.1007/978-0-387-69010-0  |z Texto Completo 
912 |a ZDB-2-ENG 
912 |a ZDB-2-SXE 
950 |a Engineering (SpringerNature-11647) 
950 |a Engineering (R0) (SpringerNature-43712)