Cargando…

Nanopackaging Nanotechnologies and Electronics Packaging /

Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Morris, James E. (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2008.
Edición:1st ed. 2008.
Temas:
Acceso en línea:Texto Completo

MARC

LEADER 00000nam a22000005i 4500
001 978-0-387-47326-0
003 DE-He213
005 20220119111229.0
007 cr nn 008mamaa
008 100301s2008 xxu| s |||| 0|eng d
020 |a 9780387473260  |9 978-0-387-47326-0 
024 7 |a 10.1007/978-0-387-47325-3  |2 doi 
050 4 |a T174.7 
050 4 |a TA418.9.N35 
072 7 |a TBN  |2 bicssc 
072 7 |a TEC027000  |2 bisacsh 
072 7 |a TBN  |2 thema 
082 0 4 |a 620.5  |2 23 
245 1 0 |a Nanopackaging  |h [electronic resource] :  |b Nanotechnologies and Electronics Packaging /  |c edited by James E. Morris. 
250 |a 1st ed. 2008. 
264 1 |a New York, NY :  |b Springer US :  |b Imprint: Springer,  |c 2008. 
300 |a XXI, 543 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a Nanopackaging: Nanotechnologies and Electronics Packaging -- Modelling Technologies and Applications -- Application of Molecular Dynamics Simulation in Electronic Packaging -- Advances in Delamination Modeling -- Nanoparticle Properties -- Nanoparticle Fabrication -- Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges -- Nanostructured Resistor Materials -- Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging -- Nanoconductive Adhesives -- Nanoparticles in Microvias -- Materials and Technology for Conductive Microstructures -- A Study of Nanoparticles in SnAg-Based Lead-Free Solders -- Nano-Underfills for Fine-Pitch Electronics -- Carbon Nanotubes: Synthesis and Characterization -- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications -- Carbon Nanotubes for Thermal Management of Microsystems -- Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes -- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes -- Nanowires in Electronics Packaging -- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging -- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities -- Nanoelectronics Landscape: Application, Technology, and Economy -- Errata. 
520 |a Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for Industrial and academic researchers as well as practicing engineers seeking information about the latest techniques, including: The importance of computer modeling in nanopackaging and offers suggestions for implementation Carbon Nanotubes and Nanoparticles, and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control A comprehensive overview of nanoscale electronics and systems packaging Nanopackaging: Nanotechnologies and Electronics Packaging is an ideal reference for researchers, practicing engineers as well as graduate students who are either entering the field of for the first time, or those already conducting research and want to expand their knowledge in the field of nanopackaging. 
650 0 |a Nanotechnology. 
650 0 |a Electrochemistry. 
650 0 |a Electronics. 
650 1 4 |a Nanotechnology. 
650 2 4 |a Electrochemistry. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
700 1 |a Morris, James E.  |e editor.  |4 edt  |4 http://id.loc.gov/vocabulary/relators/edt 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9780387564432 
776 0 8 |i Printed edition:  |z 9781441942906 
776 0 8 |i Printed edition:  |z 9780387473253 
856 4 0 |u https://doi.uam.elogim.com/10.1007/978-0-387-47325-3  |z Texto Completo 
912 |a ZDB-2-CMS 
912 |a ZDB-2-SXC 
950 |a Chemistry and Materials Science (SpringerNature-11644) 
950 |a Chemistry and Material Science (R0) (SpringerNature-43709)