Solder Joint Technology Materials, Properties, and Reliability /

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Tu, King-Ning (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2007.
Edición:1st ed. 2007.
Colección:Springer Series in Materials Science, 92
Temas:
Metals.
Electronic circuits.
Security systems.
Manufactures.
Electronics.
Metals and Alloys.
Electronic Circuits and Systems.
Security Science and Technology.
Machines, Tools, Processes.
Electronics and Microelectronics, Instrumentation.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Copper-Tin Reactions
  • Copper-Tin Reactions in Bulk Samples
  • Copper-Tin Reactions in Thin-Film Samples
  • Copper-Tin Reactions in Flip Chip Solder Joints
  • Kinetic Analysis of Flux-Driven Ripening of Copper-Tin Scallops
  • Spontaneous Tin Whisker Growth: Mechanism and Prevention
  • Solder Reactions on Nickel, Palladium, and Gold
  • Electromigration and Thermomigration
  • Fundamentals of Electromigration
  • Electromigration in Flip Chip Solder Joints
  • Polarity Effect of Electromigration on Solder Reactions
  • Ductile-to-Brittle Transition of Solder Joints Affected by Copper-Tin Reaction and Electromigration
  • Thermomigration.

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