Solder Joint Technology Materials, Properties, and Reliability /

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Tu, King-Ning (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer New York : Imprint: Springer, 2007.
Edición:1st ed. 2007.
Colección:Springer Series in Materials Science, 92
Temas:
Metals.
Electronic circuits.
Security systems.
Manufactures.
Electronics.
Metals and Alloys.
Electronic Circuits and Systems.
Security Science and Technology.
Machines, Tools, Processes.
Electronics and Microelectronics, Instrumentation.
Acceso en línea:Texto Completo
Descripción
Sumario:Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
Descripción Física:XVI, 370 p. online resource.
ISBN:9780387388922
ISSN:2196-2812 ;

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