Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Greig, William (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2007.
Edición:1st ed. 2007.
Temas:
Electronics.
Electronic circuits.
Engineering design.
Optical materials.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Engineering Design.
Optical Materials.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Electronic Manufacturing and the Integrated Circuit
  • Integrated Circuit Manufacturing: A Technology Resource
  • Packaging the IC-Single Chip Packaging
  • The Chip Scale Package
  • Multichip Packaging
  • Known Good Die (KGD)
  • Packaging Options-Chip on Board
  • Chip & Wire Assembly
  • Tape Automated Bonding-TAB
  • Flip Chip-The Bumping Processes
  • Flip Chip Assembly
  • HDI Substrate Manufacturing Technologies: Thin Film Technology
  • HDI Substrate Manufacturing Technologies: Thick Film Technology
  • HDI Substrate Manufacturing Technologies: Cofired Ceramic
  • Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate.

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